Open-Silicon Tapes Out Industry's First High Bandwidth Memory

Closing the Memory Gap: Can Advanced Fab and Packaging Finally

AI-designed Chips Reach Scale with First 100 Commercial Tape-outs Using Synopsys Technology - Feb 7, 2023

Memory and Storage Hierarchy gaps happen; fixing them delivers performance you can feel, by Frank Hady, Performance at Intel

Open-Silicon Announces Comprehensive High Bandwidth Memory (HBM) Gen2 IP Subsystem Solution

DDR IP, Interface IP

News] Memory Titans Vie for Control in HBM Tech, Who Will Shape the Next-Gen?

Accelerating High-Bandwidth Memory to light speed – Blocks and Files

DDR5 DRAM, DDR5 SDRAM

Semiconductor Sales To Rise at 7.1% CAGR Through 2026